Date: 4 June 2021
Registration is now open for the 82nd Conference on Glass Problems
Join your peers in Columbus, Ohio, November 1–4, 2021
REGISTER NOW!
The 82nd Conference on Glass Problems (GPC), organized by the Glass Manufacturing Industry Council (GMIC) and Alfred University, is the largest glass manufacturing conference in North America, attracting glass manufacturers and suppliers worldwide to exchange innovations and solutions. The GPC is devoted to the technical issues facing professionals responsible for the successful operations of glass manufacturing companies and features two full days of invited and contributed talks.
Register now for this high-value resource for the glass industry professional. Invited experts will present the latest technologies, problem solutions and innovations in glass melting, refractories, energy efficiency, process control, modeling, safety, emissions, raw materials & batching, forming, and more.
Review the full four-day program of speakers and events. Register before October 1, 2021 and save $50!
Showcase your company during 82nd GPC
Reserve your day-long exhibit booth space or evening hospitality space at GPC to meet customers and network. Only a few exhibit and hospitality spaces remain!
Contact Mona Thiel (614) 794-5834 to reserve your exhibit space.
Student Travel Grants
Student Travel Grants help support student travel to the 82nd GPC. GMIC will award student travel grants in the amount of $500.00 to offset student travel expenses.
All students are eligible to receive complimentary registration to the 82nd GPC, Short Course and the GMIC Symposium and reduced-price lodging.
For more information on student travel grants visit here!
Deadline to apply is September 23, 2021.
Book your room
Reserve your room at the Hilton Columbus Downtown.
401 North High Street Columbus, Ohio, USA, 43215
+1 (800) 445-8667
Group rate: Group rate is $189.00 USD + tax, based on availability. Reference group code GPC21. Deadline is on or before October 9, 2021 or until rooms in our block are sold out.
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